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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1995 Volume number : 18 Issue: 02

Performance And Reliability Of Optical Fiber Connectors In The Outside Plant Environment (Article)
Subject: Performance , Outside-In , Plant Roots , Optical Fiber Connector
Author: A.K. Agarwal      Lynn D. Hutcheson     
page:      221 - 226
A Small Coaxial Laser Module For The Gb/S Transmission-Speed Range (Article)
Subject: Small Core , Module , Small Cell
Author: Hein Van Tongeren      Henk Tjassens      Jan W. Kokkelink     
page:      227 - 231
Fabrication Of Low Loss Polyimide Optical Waveguides Using Thin-Film Multichip Module Process Technology (Article)
Subject: Fabrication , Waveguides , Process Shift
Author: Allyson J. Beuthler      David A Wargowski      Kenneth D. Singer     
page:      232 - 234
Low-Loss Intersecting Grooved Waveguides With Low For A Self-Holding Optical Matrix Switch (Article)
Subject: Low-Loss Waveguide , Self Boring , Optical
Author: Yoriko Hanaoka      Yasuhide Nishida      Fusao Shimokawa     
page:      241 - 244
Laser-Detector-Hologram Unit For Thin Optical Pick-Up Head Of A Cd Player (Article)
Subject: Laser Diode , Cd , Pick-And-Place
Author: Akio Yoshikawa      Kunio Itoh      Toru Musha     
page:      245 - 249
C-4/Cbga Comparison With Other Mlc Single Chip Package Alternatives (Article)
Subject: Alternative Fuel , Chip Seal
Author: Karl J. Puttlitz      William F. Shutler     
page:      250 - 256
Reliable Au-Sn Flip-Chip Bonding On Flexible Prints (Article)
Subject: Reliable , Flexible , Flip-Chip
Author: Antal F. J. Baggerman      Martin J. Batenburg     
page:      257 - 263
Mechanical And Electrical Evaluation Of A Bumped-Substrate Die-Level Burn-In Carrier (Article)
Subject: Mechanical , Burn-In , Carrierless
Author: Patrick Thompson      Don R. Vanoverloop      Barbara Vasquez     
page:      264 - 268
Mcm-Ld: Large Area Processing Using Photosensitive-Bcb (Article)
Subject: Mcm , Area Of Prestressing Steel , Photosensitivity
Author: Andrew J. G. Strandjord      Garrou Philip E.      Theodore G. Tessier     
page:      269 - 276
Manufacturability Of Capacitively Coupled Multichip Modules (Article)
Subject: Manufacturability , Multichip Modules
Author: David B. Salzman      Thomas F. Knight     
page:      277 - 281
Conductive Adhesives For Smt And Potential Applications (Article)
Subject: Conductive Adhesive , Potential Advantages
Author: Henrik L. Hvims     
page:      284 - 291
Electrically Conductive Adhesives: A Prospective Alternative For Smd Soldering (Article)
Subject: Electric Bicycles , Conductive Adhesive , Soldering Error
Author: J. C. Jagt      G. F. C. M. Lijten      P. J. M. Beris     
page:      292 - 298
Reliability Assessment Of Isotropically Conductive Adhesive Joints In Surface Mount Applications (Article)
Subject: Reliability , Mount , Application , Surface
Author: Roger S. Rorgren      Johan Liu     
page:      305 - 312
Development Of Conductive Adhesive Joining For Surface-Mounting Electronics Manufacturing (Article)
Subject: Development , Electronics , Manufacturing
Author: Johan Liu      Zonghe Lai      Lars Ljungkrona     
page:      313 - 319
Reliability Issues Of Replacing Solder With Conductive Adhesives In Power Modules (Article)
Subject: Relibility Assessment , Power , Conductive Adhesive
Author: Outi Rusanen      Jaako Lenkkeri     
page:      320 - 325
Electroless Nickel/Copper Plating As A New Bump Metallization (Article)
Subject: Electroless , Bump Pitch , Metallization
Author: Rolf Aschenbrenner      H. Reichl      Jurgen Simon     
page:      334 - 338
Performance, Wireability, And Cooling Tradeoffs For Planar And 3-D Packaging Architectures (Article)
Subject: Performance , Packaging , Architecture
Author: George George      J. Peter Lrusius     
page:      339 - 345
Thick-Film Resistor/Dielectric Interactions In A Low Temperature Co-Fired Ceramic Package (Article)
Subject: Resistor , Interactions Of Methanogens , Ceramic Ball
Author: Robert C. Sutterlin      James V. Biggers      Gordon O. Dayton     
page:      346 - 332
Corrosion In Plastic Packages-Sensitive Initial Delamination Recognition (Article)
Subject: Corrosion , Sensitive Clay , Sensing
Author: Otmar Selig      Rainer Tilgner      Peter Alpern     
page:      353 - 357
Latent Open Defect Detection Using Phase-Sensitive Nonlinearity Detection Technique (Article)
Subject: Latent Dirichlet Allocation , Detection , Nonlinearity
Author: Arnold Halperin      Shinwu Chiang      Thomas H. Distefano     
page:      358 - 365
Inner Lead Gang-Bonded Devices With Stacked Ni-Au Bumps (Article)
Subject: Lead , Stacked
Author: Antal F. L. Baggerman      Jo A. H. Gerven     
page:      366 - 374
An Extended Time-Domain Network Analysis Measurement Technique (Article)
Subject: Extended Least , Technique For Order Preference By Similarity To Ideal Solution (Topsis) Method
Author: Lih-Tyng Hwang      Glenn A. Rinne      Lwona Turlik     
page:      375 - 380
Power Cycling And Stress Variation In A Multichip Module (Article)
Subject: Power Control , Multichip Module
Author: Biswajit Sur      Lwona Turlik     
page:      388 - 396