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Your search returned 23 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1995 Volume number : 18 Issue: 02 |
Performance And Reliability Of Optical Fiber Connectors In The Outside Plant Environment
(Article)
Subject:
Performance
,
Outside-In
,
Plant Roots
,
Optical Fiber Connector
Author:
A.K.
Agarwal
Lynn D.
Hutcheson
page:
221
-
226
A Small Coaxial Laser Module For The Gb/S Transmission-Speed Range
(Article)
Subject:
Small Core
,
Module
,
Small Cell
Author:
Hein Van
Tongeren
Henk
Tjassens
Jan W.
Kokkelink
page:
227
-
231
Fabrication Of Low Loss Polyimide Optical Waveguides Using Thin-Film Multichip Module Process Technology
(Article)
Subject:
Fabrication
,
Waveguides
,
Process Shift
Author:
Allyson J.
Beuthler
David A
Wargowski
Kenneth D.
Singer
page:
232
-
234
Low-Loss Intersecting Grooved Waveguides With Low For A Self-Holding Optical Matrix Switch
(Article)
Subject:
Low-Loss Waveguide
,
Self Boring
,
Optical
Author:
Yoriko
Hanaoka
Yasuhide
Nishida
Fusao
Shimokawa
page:
241
-
244
Laser-Detector-Hologram Unit For Thin Optical Pick-Up Head Of A Cd Player
(Article)
Subject:
Laser Diode
,
Cd
,
Pick-And-Place
Author:
Akio
Yoshikawa
Kunio
Itoh
Toru
Musha
page:
245
-
249
C-4/Cbga Comparison With Other Mlc Single Chip Package Alternatives
(Article)
Subject:
Alternative Fuel
,
Chip Seal
Author:
Karl J.
Puttlitz
William F.
Shutler
page:
250
-
256
Reliable Au-Sn Flip-Chip Bonding On Flexible Prints
(Article)
Subject:
Reliable
,
Flexible
,
Flip-Chip
Author:
Antal F. J.
Baggerman
Martin J.
Batenburg
page:
257
-
263
Mechanical And Electrical Evaluation Of A Bumped-Substrate Die-Level Burn-In Carrier
(Article)
Subject:
Mechanical
,
Burn-In
,
Carrierless
Author:
Patrick
Thompson
Don R.
Vanoverloop
Barbara
Vasquez
page:
264
-
268
Mcm-Ld: Large Area Processing Using Photosensitive-Bcb
(Article)
Subject:
Mcm
,
Area Of Prestressing Steel
,
Photosensitivity
Author:
Andrew J. G.
Strandjord
Garrou
Philip E.
Theodore G.
Tessier
page:
269
-
276
Manufacturability Of Capacitively Coupled Multichip Modules
(Article)
Subject:
Manufacturability
,
Multichip Modules
Author:
David B.
Salzman
Thomas F.
Knight
page:
277
-
281
Conductive Adhesives For Smt And Potential Applications
(Article)
Subject:
Conductive Adhesive
,
Potential Advantages
Author:
Henrik L.
Hvims
page:
284
-
291
Electrically Conductive Adhesives: A Prospective Alternative For Smd Soldering
(Article)
Subject:
Electric Bicycles
,
Conductive Adhesive
,
Soldering Error
Author:
J. C.
Jagt
G. F. C. M.
Lijten
P. J. M.
Beris
page:
292
-
298
Reliability Assessment Of Isotropically Conductive Adhesive Joints In Surface Mount Applications
(Article)
Subject:
Reliability
,
Mount
,
Application
,
Surface
Author:
Roger S.
Rorgren
Johan
Liu
page:
305
-
312
Development Of Conductive Adhesive Joining For Surface-Mounting Electronics Manufacturing
(Article)
Subject:
Development
,
Electronics
,
Manufacturing
Author:
Johan
Liu
Zonghe
Lai
Lars
Ljungkrona
page:
313
-
319
Reliability Issues Of Replacing Solder With Conductive Adhesives In Power Modules
(Article)
Subject:
Relibility Assessment
,
Power
,
Conductive Adhesive
Author:
Outi
Rusanen
Jaako
Lenkkeri
page:
320
-
325
Electroless Nickel/Copper Plating As A New Bump Metallization
(Article)
Subject:
Electroless
,
Bump Pitch
,
Metallization
Author:
Rolf
Aschenbrenner
H.
Reichl
Jurgen
Simon
page:
334
-
338
Performance, Wireability, And Cooling Tradeoffs For Planar And 3-D Packaging Architectures
(Article)
Subject:
Performance
,
Packaging
,
Architecture
Author:
George
George
J. Peter
Lrusius
page:
339
-
345
Thick-Film Resistor/Dielectric Interactions In A Low Temperature Co-Fired Ceramic Package
(Article)
Subject:
Resistor
,
Interactions Of Methanogens
,
Ceramic Ball
Author:
Robert C.
Sutterlin
James V.
Biggers
Gordon O.
Dayton
page:
346
-
332
Corrosion In Plastic Packages-Sensitive Initial Delamination Recognition
(Article)
Subject:
Corrosion
,
Sensitive Clay
,
Sensing
Author:
Otmar
Selig
Rainer
Tilgner
Peter
Alpern
page:
353
-
357
Latent Open Defect Detection Using Phase-Sensitive Nonlinearity Detection Technique
(Article)
Subject:
Latent Dirichlet Allocation
,
Detection
,
Nonlinearity
Author:
Arnold
Halperin
Shinwu
Chiang
Thomas H.
Distefano
page:
358
-
365
Inner Lead Gang-Bonded Devices With Stacked Ni-Au Bumps
(Article)
Subject:
Lead
,
Stacked
Author:
Antal F. L.
Baggerman
Jo A. H.
Gerven
page:
366
-
374
An Extended Time-Domain Network Analysis Measurement Technique
(Article)
Subject:
Extended Least
,
Technique For Order Preference By Similarity To Ideal Solution (Topsis) Method
Author:
Lih-Tyng
Hwang
Glenn A.
Rinne
Lwona
Turlik
page:
375
-
380
Power Cycling And Stress Variation In A Multichip Module
(Article)
Subject:
Power Control
,
Multichip Module
Author:
Biswajit
Sur
Lwona
Turlik
page:
388
-
396
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